Shanghai Liyuan Micro Semiconductor Co., Ltd.  specializes in System-in-Package (SiP) and Chiplet advanced packaging customization, delivering turnkey solutions from ASIC design, SiP simulation, and wafer sourcing through volume packaging, system test, and failure analysis.

        With deep expertise in packaging for integrated circuits, MEMS, and optoelectronic devices, the company has shipped over 100 million SiP/Chiplet units to date. Powered by our proprietary platform, we help customers significantly reduce R&D costs, accelerate time-to-market, and reduce project qualification hurdles.

        Our Nanjing production facility features 2,200 m² of high-standard cleanroom space and a full suite of advanced packaging and test equipment. We excel in high-precision placement of ultra-thin components and heterogeneous multi-die assemblies, with core capabilities including sputtered EMI shielding. Volume production covers mainstream advanced processes such as FC-SiP, Stack Die, FCFBGA, and fcPoP, serving industrial, power, telecommunications, storage, MEMS, processor, and related applications with customized, end-to-end packaging and test services.