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Chiplet Design (SoC + SiP)

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Chiplet Design (SoC + SiP)

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SiP Packaging
Chiplet Design (SoC + SiP)
Wafer Sourcing for SiP Packaging
SiP Assembly Manufacturing
System-Level Testing for SiP
Chiplet Reliability and Failure Analysis
Sales of Semiconductor Inspection

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13817180836

Mr. Wang

Floor 3, Building X3, No. 8 Longyao Road, Xuhui District, Shanghai, China (Zone X, Alibaba Xuhui Riverside Park)

Chiplet Design (SoC + SiP)

Shanghai Liyuan Micro Semiconductor Co., Ltd.

Specializing in SiP packaging, Chiplet design, and system-level testing — delivering integrated solutions from concept design and wafer procurement to high-volume packaging.

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Address: Floor 3, Building X3, No. 8 Longyao Road, Xuhui District, Shanghai, China (Zone X, Alibaba Xuhui Riverside Park)
Phone: 13817180836
Email: 13817180836@163.com

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