Semiconductor Packaging Expertise

Comprehensive SiP Packaging Solutions

About Us

Expertise · Innovation · Excellence

Shanghai Liyuan Micro Semiconductor Co., Ltd. specializes in System-in-Package (SiP) and Chiplet advanced packaging customization, delivering turnkey solutions from ASIC design, S...

Custom advanced packaging solutions for SiP and Chiplet
High-reliability packaging processes and failure analysis capabilities
Robust quality management and reliable on-time delivery

Products & Solutions

End-to-End Packaging Services

Complete semiconductor packaging solutions from design through test

Case Studies

Customer Success

Volume production across consumer electronics, telecommunications, automotive electronics, and more

Photoelectric Sensors, Photoelectric Switches, Safety Light Curtains

Photoelectric Sensors, Photoelectric Swi......

Fire Emergency Light Sensor and Control Module

Fire Emergency Light Sensor and Control ......

Smart Wearable IoT Products

Smart Wearable IoT Products...

Battery Monitoring Module

Battery Monitoring Module...

Model X Encrypted Control Communication Module

Model X Encrypted Control Communication ......

Wireless Smoke Sensor Module

Wireless Smoke Sensor Module...

News & Insights

Industry Updates

The latest on semiconductor packaging, Chiplet technology, system-level test, and company developments

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