Wafer Procurement Service for SiP Packaging

Liyuan Micro Semiconductor has established long-term collaborations with numerous chip manufacturers (including international and domestic ones such as ST, NXP, TI, ADI, etc.) to procure wafers for internal chips used in SiP packaging on behalf of customers. This reduces communication costs and lead time between customers and manufacturers, thereby improving SiP packaging efficiency.

Main chips include: DCDC power chips, LDO voltage regulators, PMIC power management chips, operational amplifiers, comparators, MCUs, 485/422 interface chips, Flash/DDR memory chips, transistors/diodes, passive components, and more.