End-to-End Packaging Services
Complete semiconductor packaging solutions from design through test
System-in-Package (SiP) solutions integrate multiple functional chips within a single package, significantly enhancing system performance, reducing package size, and lowering power consumption. We provide end-to-end services from solution design and packaging process development through volume production, serving consumer electronics, telecommunications, automotive electronics, and more.
Advanced Chiplet architecture design services enabling deep integration of SoC (System-on-Chip) and SiP (System-in-Package). Through modular design principles, complex SoCs are decomposed into multiple functional Chiplets and flexibly integrated within SiP, achieving comprehensive improvements in performance, cost, and yield. Suitable for high-performance computing, AI acceleration, communication baseband, and other applications.
Professional wafer sourcing services providing the die and wafers required for SiP packaging. We maintain strategic partnerships with global wafer suppliers, offering 500+ wafer options covering consumer electronics, telecommunications, automotive electronics, industrial control, and other application areas, ensuring supply chain stability and product quality.
High-volume SiP and Chiplet packaging production through partnerships with qualified manufacturing partners, ensuring supply chain stability. Our end-to-end quality control spans design, production, and test, enabling dependable product delivery from prototype through high-volume production.
Comprehensive system-level test services covering functional, performance, and reliability validation. Our advanced test platforms and established procedures ensure SiP stability and reliability across diverse application scenarios. End-to-end support from test plan development through execution.
Professional reliability testing and failure analysis services ensuring long-term stable operation of Chiplet products. We provide various reliability tests including temperature cycling, high-temperature storage, humidity testing, and mechanical shock, and leverage advanced failure analysis to rapidly pinpoint root causes and recommend corrective actions.
Advanced semiconductor testing equipment supporting the full packaging and testing workflow. We partner with equipment suppliers to provide customers with various testing equipment from wafer testing, packaging testing to system-level testing, including testers, probe stations, sorters, and more, along with installation, commissioning, and training services.
Turnkey hardware PCB design, simulation, and low-volume manufacturing for rapid chip bring-up, test, and validation.