SiP/Chiplet System-Level Packaging Testing

After bare chips go through various packaging processes to become packaged devices and modules, testing is required. This testing is commonly referred to as "Final Test (FT)" or "Package Test." In terms of circuit characteristic requirements, FT testing typically adheres to stricter standards than CP testing. Devices may undergo multiple tests under different temperature conditions to ensure that temperature-sensitive parameters function correctly. The diagram below illustrates the FT process:

Liyuan Micro Semiconductor offers both laboratory-level and production-level testing services. Laboratory-level testing services are suitable for the early product development phase and offer greater flexibility. The current laboratory testing capabilities are shown in the table below: