Customer: Shenzhen XXXX Technology Co., Ltd. – IoT solution provider

Integrated Devices: 2 chips (BLE Bluetooth chip, NorFlash) + 9 passive components

① BLE Bluetooth chip: Xiamen Linsight Microelectronics

② NorFlash: Beijing GigaDevice

③ Passive components: Domestic passive components

Addressing Customer Pain Points:

① Reduce system size/volume (by more than 40%)

② Confidentiality and anti-copy protection

③ Customized package form factor as required for ease of subsequent installation

Annual Shipment: 3kk pcs/year