Customer: Customer: National Defense Research Institute

Integrated Devices: 7 chips (FPGA + NANDFlash, NandFlash Controller, NorFlash, encryption chip, DC/DC) + 36 passive components

① FPGA chip: Actel A3P030

② NandFlash: Micron

③ NorFlash: GigaDevice

④ DCDC: Texas Instruments (TI)

⑤ Encryption chip: Infineon

⑥ Passive components: Domestic passive components

Addressing Customer Pain Points:

① Reduce system size/volume (by more than 60%)

② Enhance system reliability

③ Ceramic packaging with high-temperature resistance

④ Customized package form factor as required for ease of subsequent installation

Annual Shipment: 150k pcs/year