As phones get faster and AI becomes smarter, you might think chips are just getting smaller and more精密.

But today, the chip industry is welcoming a "building block revolution" – and its name is Chiplet.

I. Traditional Chips: Carving a Whole Piece of Jade – Too Difficult!

In the past, making chips was like carving a whole piece of jade:

• CPU, GPU, memory, and I/O interfaces were all crammed onto the same silicon die

• Had to use the most advanced, most expensive process nodes (3nm/5nm) from start to finish

• The slightest defect would scrap the entire large chip

• Costs skyrocket, yield plummets, R&D moves at a snail's pace

Moore's Law is approaching its end, and traditional chips have hit a wall.

II. Chiplet: Break Chips into LEGOs, Freely Assemble!

Chiplet is simple: break large chips into small, function-specific chips, then reassemble them using advanced packaging.

• Compute Chiplet: Handles high-speed operations (using 3nm/5nm cutting-edge processes)

• I/O Chiplet: Handles data transmission (using mature 28nm process – cheap and stable)

• Memory Chiplet: Handles data storage (paired with HBM high-bandwidth memory)

• Specialized Chiplets: AI acceleration, signal processing, power management…

Each small chip does its own job, uses its most suitable process, and is then "glued" together using 2.5D/3D packaging.

From the outside, it still looks like one chip; on the inside, it's a miniature supercomputer cluster.

III. What makes Chiplet so powerful? 3 Core Advantages

1. Drastically lower costs, dramatically higher yield

• Small chip area means yield can easily exceed 90%+

• No need to use the most expensive processes for everything – overall cost reduced by 30%–50%

• If one small chip is bad, just replace that one – no need to scrap the whole thing

2. As flexible as building blocks

• Want a high-performance CPU? Add more compute chiplets

• Want an AI-specific chip? Add AI accelerator chiplets

• Want to upgrade? Swap out old chiplets and plug in new ones – no need to redesign everything

3. Higher performance, lower power consumption

• Short-distance, high-density interconnect – bandwidth doubles, latency drops

• 3D stacking is like building a skyscraper – smaller footprint, stronger computing power

• Heterogeneous integration – performance increases by 15%–200%, power consumption drops significantly

IV. Who is using it? Major players have already gone all in

• AMD: EPYC CPUs and MI series AI accelerators are all Chiplet-based architectures

• Intel: Core Ultra and Xeon processors are fully transitioning to Chiplet

• NVIDIA: Next-generation AI chips will大规模 adopt chiplet integration

• Domestic chips: Loongson, Hygon, Cambricon… all see Chiplet as a key opportunity to catch up and overtake

V. Why is it called the next big trend?

• Market explosion: $54.5 billion in 2025, projected to exceed $350 billion by 2034

• Main theme of the post-Moore era: Process nodes approach physical limits – Chiplet = the new Moore's Law

• Game-changer for domestic chip industry: No need to obsess over sub-7nm – mature processes + advanced packaging = high-end computing power

VI. One-sentence summary

Chiplet is not a "small improvement" for chips – it is a complete revolution:

From "whole-block carving" to modular building blocks, making chips cheaper, stronger, faster, and more flexible.

Whether it's AI, data centers, mobile phones, or automotive electronics – Chiplet is the future.

Shanghai Liyuan Micro Semiconductor Co., Ltd. is a professional SiP system-level packaging solution development platform. For many years, we have provided customers with one-stop services and solutions including ASIC chip design, SiP packaging design and simulation, wafer procurement for internal SiP use, packaging production, system-level testing, reliability and failure analysis. Our company offers free SiP/Chiplet design consulting and services to all customers, and is dedicated to helping customers achieve design goals such as small form factor, low power consumption, and low cost. If interested, please feel free to contact us at 13817180836 (WeChat ID same as phone number).